![]() The "Zen 4" CPU core is larger, on account of more number-crunching machinery to achieve the IPC increase and new instruction-sets, as well as the larger per-core L2 cache. The leap to 5 nm for the CCD enables AMD to cram up to 16 "Zen 4" cores per socket, all of which are "performance" cores. The CCDs are built on the 5 nm silicon fabrication process, while the I/O die is built on the 6 nm process, a significant upgrade from previous-generation I/O dies that were built on 12 nm. Much like Ryzen 3000 "Matisse," and Ryzen 5000 "Vermeer," the Ryzen 7000 "Raphael" desktop processor is a multi-chip module with up to two "Zen 4" CCDs (CPU core dies), and one I/O controller die. ![]() The transition to the LGA1718 Socket AM5 allows AMD to use next-generation I/O, including DDR5 memory, and PCI-Express Gen 5, both for the graphics card, and the M.2 NVMe slot attached to the CPU socket. With Zen 4, AMD is introducing a new instruction set for AI compute acceleration. Based on the way AMD has worded their claims, it seems that the "+15%" number includes IPC gains, plus gains from higher clocks, plus what the DDR4 to DDR5 transition achieves. Other key specs about the architecture put out by AMD include a doubling in per-core L2 cache to 1 MB, up from 512 KB on all older versions of "Zen." The Ryzen 7000 desktop CPUs will boost to frequencies above 5.5 GHz. The new Ryzen 7000 series processors introduce the new "Zen 4" microarchitecture, with the company claiming a 15% single-threaded uplift over "Zen 3" (16-core/32-thread Zen 4 processor prototype compared to a Ryzen 9 5950X). ![]() ![]() AMD today unveiled its next-generation Ryzen 7000 desktop processors, based on the Socket AM5 desktop platform. ![]()
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